Vélizy-Villacoublay, France—April 9, 2013—Dassault Systèmes, a global provider of 3D design, 3D digital mock up and Product Lifecycle Management (PLM) solutions, launched its new industry solution experience for high tech companies called “HT body.” Based on Dassault Systèmes’ 3DEXPERIENCE platform, HT body helps electronics manufacturers accelerate the design and the delivery of high-quality and differentiated electronic devices.
“Fast moving and highly sensitive to consumer demand, the high-tech device market is all about the first touch, the first sight, that first moment of emotional experience,” said Monica Menghini, Executive Vice President, Industry and Marketing, Dassault Systèmes. “To be successful, companies need to ensure they’re capturing that demand and delivering the experience consumers want in a high tech consumer device. That’s what the 3DEXPERIENCE platform enables—fast innovation, fast production and a product experience the consumer loves.”
Focused on the enclosures and chassis, “HT body” captures consumers' demands and enables differentiated product innovation to boost design creativity of electronics manufacturers and to keep them directly on target for a best-selling product. It also streamlines communication between all internal and external product development, engineering and manufacturing stakeholders; and gives them the social innovation and visualization applications needed to better connect with customers and understand what they want in a product. With “HT body,” companies can quickly respond to external events—such as the way the public feels about a certain model or design—and rapidly adapt their plans as needed.
Built on Dassault Systèmes’ 3DEXPERIENCE platform, “HT body” combines comprehensive best practices via a single, pre-integrated, proven design and engineering experience. This approach provides an experience where relationships between customer and company, industrial product design and product development, and even between product development and manufacturing, are more tightly integrated to speed innovation and information transfer during the entire product innovation experience.